C17200/C17000 high-strength beryllium copper substrate, nickel plated base+0.05-0.2 μ m selective gold plating, paired with multi contact design. Beryllium copper is resistant to high temperature and stress relaxation The gold layer is resistant to oxidation and inhibits embrittlement of the IMC layer, maintaining low contact resistance; Relying on BOSI's micrometer level precision manufacturing, we control the parameters of the shrapnel to ensure uniform stress and avoid local relaxation.
High conductivity oxygen free copper (C1011/C1020, conductivity ≥ 100% IACS) silver plated, wing structure increases heat dissipation area, smooth transition design prevents current crowding and local overheating; Silver has high thermal conductivity and high thermal characteristics, significantly reducing contact resistance and optimizing interface thermal conductivity.
High corrosion resistant PdNi10 palladium nickel alloy coated with thin gold, with a hardness of 500-600HV, wear-resistant and able to withstand thousands of insertions without penetration, protecting the underlying metal to maintain long-term performance: it has excellent biocompatibility and surface integrity, low and stable contact resistance, and can completely prevent nickel leakage.
Language
Your location：
Official account
0769-82928019
E-mail