BOSI provides not only connectors (terminals), but also delivers predictable, verifiable and traceable system-level reliability for electrical interfaces. We specialize in custom conductive material development and micro-scale precision forming. Whether it is charging gun terminals or internal connectors for medical devices, we guarantee lifelong reliability at every connection point.

Scenario-based Solution 1: Stable Connection Strength Under High Temperatures

Challenge: Connector terminals are prone to failure in environments with temperatures above 150°C, such as automotive engine bays and motor controllers of new energy vehicles.BOSI Solution: We adopt high-strength beryllium copper (C17200 / C17000) combined with a nickel underlayer, selective gold plating and a multi-contact structure. Beryllium copper delivers outstanding resistance to stress relaxation at high temperatures. A thin gold layer (0.05–0.2 μm) is coated on top of the nickel base. Gold features excellent oxidation resistance and rarely forms thick, brittle intermetallic compound (IMC) layers with nickel, maintaining stable low contact resistance in long-term service.Dual-contact or multi-contact designs are applied to enhance system redundancy. Leveraging our micro-scale precision manufacturing expertise, we accurately control the bend radius and effective length of contact springs to achieve uniform stress distribution during operation, and prevent accelerated stress relaxation caused by localized stress concentration.

Scenario-based Solution 2: High-Current Joule Heat Management

Challenge: How to eliminate local hotspots exceeding 200°C and slow down material aging.BOSI Solution: We use high-conductivity oxygen-free copper (C1011 / C1020, conductivity ≥ 100% IACS) with silver plating. Heat dissipation fins are designed on products to enlarge the air contact area for improved heat dissipation. Meanwhile, smooth transitional structures are adopted to avoid abrupt changes in cross-sectional area, so as to prevent current crowding and local overheating.As the metal with the highest electrical and thermal conductivity, silver can greatly reduce contact resistance and optimize heat conduction at contact interfaces.

Scenario-based Solution 3: High-Solderability Shielding Cans

Challenge: Shielding cans for PCB grounding require superior solderability and electrical conductivity.BOSI Solution: This product adopts a copper substrate with a nickel underlayer and a matte tin top finish. Our precision manufacturing process controls flatness within 0.05 mm, ensuring full fitting of contact surfaces and reducing oxidation risks.Furthermore, low-porosity plating technology and regulated surface roughness (Ra 0.1 μm ~ 0.4 μm) can effectively break through potential thin oxide films, and ensure reliable metal-to-metal contact between surfaces.