
Product specifications: Customized according to customer requirements
Material characteristics: Compliant with ROHS and SGS testing
Sampling time: about 3 days
Mold opening time: about a week
Mold type: continuous mold
Process type: fast wire walking, slow wire walking
Flatness: tolerance ± 0.05mm
Cleaning method: Ultrasonic cleaning
Packaging: Blister tray/roll tape packaging
Product advantages: Lightweight and precise in size
Application: Suitable for mobile phones, computers GPS、 Watches, digital products, etc
Certification: ISO9001&IATF16949
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Dongguan Bosi Hardware Electronics Co., Ltd
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