Material specifications: Beryllium copper (heat treated), titanium copper, phosphor bronze, stainless steel, spring steel, etc. (multiple materials available)
Product specifications: Customized according to customer requirements
Material characteristics: Compliant with ROHS and SGS testing
Sampling time: about 3 days
Mold opening time: about a week
Mold type: continuous mold
Process type: fast wire walking, slow wire walking
Product advantages: Lightweight and precise in size
Applications: Mobile SIM cards, mobile phone antennas, headphone voice sockets, connectors, micro motors, sensors, automotive instrument touch switches, medical equipment, PCB board shielding covers, etc
Certification: ISO9001&IATF16949
Product Introduction
Dongguan Bosi Hardware Electronics Co., Ltd
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